1. Sigurd Wagnerhttp://www.princeton.edu/~wagner/index.htm He is working on devices, processes, and materials for large-area electronics, which is also called macroelectronics or giant electronics.
2. Zhigang Suohttp://www.seas.harvard.edu/suo/ Allen E. and Marilyn M. Puckett Professor of Mechanics and Materials, School of Engineering and Applied Sciences, Harvard University
3. Yonggang Huanghttp://www.civil.northwestern.edu/people/huang.html Mechanics of materials and structures; fracture mechanics; composite materials; micromechanics; atomistic-based continuum mechanics; mechanics of stretchable electronics.
4. John A Rogershttp://rogers.mse.uiuc.edu/ He seeks to understand and exploit interesting characteristics of 'soft' materials, such as polymers, liquid crystals, and biological tissues as well as hybrid combinations of these materials with unusual classes of inorganics, such as nanoribbons, wires and platelets.
The Inkjet Research Centre has established an Inkjet Interest Group as part of the EPSRC and industry funded project investigating fundamental aspects of inkjet.
Energy, organic semiconductors, transistors, solar cells, carbon nanotube, transparent electrodes, sensors, soft materials, organic and polymer synthesis and characterization, nano- and micropatterning, bio-inspired assembly, and device fabrication and characterization.
His research interests include advanced CMOS devices and technology and polysilicon thin film transistor technology for displays and vertical integration applications. His current research focuses on organic electronics for display, low-cost logic, and sensing applications. He has authored or co-authored more than 40 research publications and patents.
His current work deals with the mechanical properties of nanostructures and with strain gradients and size effects on the mechanical properties of crystalline materials.
MEMS (Microelectromechanical Systems); NEMS (Nanoelectromechanical Systems); Nanotechnology; design and manufacturing of microsensors and microactuators; development of micromachining processes by silicon surface/bulk micromachining; micro moulding process; mechanical issues in microelectromechanical systems (MEMS) including heat transfer, solid/fluid mechanics and dynamics.