1. Sigurd Wagner http://www.princeton.edu/~wagner/index.htm He is working on devices, processes, and materials for large-area electronics, which is also called macroelectronics or giant electronics. 2. Zhigang Suo http://www.seas.harvard.edu/suo/ Allen E. and Marilyn M. Puckett Professor of Mechanics and Materials, School of Engineering and Applied Sciences, Harvard University 3. Yonggang Huang http://www.civil.northwestern.edu/people/huang.html Mechanics of materials and structures; fracture mechanics; composite materials; micromechanics; atomistic-based continuum mechanics; mechanics of stretchable electronics. 4. John A Rogers http://rogers.mse.uiuc.edu/ He seeks to understand and exploit interesting characteristics of 'soft' materials, such as polymers, liquid crystals, and biological tissues as well as hybrid combinations of these materials with unusual classes of inorganics, such as nanoribbons, wires and platelets. 5. Ian Hutchings http://www.ifm.eng.cam.ac.uk/pp/publications/imh.html The Inkjet Research Centre has established an Inkjet Interest Group as part of the EPSRC and industry funded project investigating fundamental aspects of inkjet. 6. Zhenan Bao http://baogroup.stanford.edu/ Energy, organic semiconductors, transistors, solar cells, carbon nanotube, transparent electrodes, sensors, soft materials, organic and polymer synthesis and characterization, nano- and micropatterning, bio-inspired assembly, and device fabrication and characterization. 7. Vivek Subramanian http://www.eecs.berkeley.edu/~viveks/ His research interests include advanced CMOS devices and technology and polysilicon thin film transistor technology for displays and vertical integration applications. His current research focuses on organic electronics for display, low-cost logic, and sensing applications. He has authored or co-authored more than 40 research publications and patents. 8. William D. Nix http://soe.stanford.edu/research/layout.php?sunetid=nix Hiscurrent work deals with the mechanical properties of nanostructures and with strain gradients and size effects on the mechanical properties of crystalline materials. 8. Liwei Lin http://www.me.berkeley.edu/~lwlin/ MEMS (Microelectromechanical Systems); NEMS (Nanoelectromechanical Systems); Nanotechnology; design and manufacturing of microsensors and microactuators; development of micromachining processes by silicon surface/bulk micromachining; micro moulding process; mechanical issues in microelectromechanical systems (MEMS) including heat transfer, solid/fluid mechanics and dynamics. 9. George Whitesides http://gmwgroup.harvard.edu/ updating
ANNU REV FLUID MECH ADV APPL MECH INT J NONLINEAR SCI INT J PLASTICITY J MECH PHYS SOLIDS J MICROMECH MICROENG J STAT MECH-THEORY E MECH MATER J RHEOL J FLUID MECH COMPUT METHOD APPL M PHYS FLUIDS RHEOL ACTA ARCH RATION MECH AN INT J SOLIDS STRUCT J NONLINEAR SCI INT J HEAT MASS TRAN COMPUT FLUIDS J NON-NEWTON FLUID INT J HEAT FLUID FL ENG FRACT MECH PHILOS MAG ENERG CONVERS MANAGE INT J MULTIPHAS FLOW INT J NONLINEAR MECH INT J IMPACT ENG WAVE MOTION EXP MECH EXP FLUIDS COMPUT MECH DYNAM SYST PROBABILIST ENG MECH J ADHESION OPEN SYST INF DYN STRUCT MULTIDISCIP O THEOR COMP FLUID DYN J TURBUL CONTINUUM MECH THERM INT J MECH SCI J APPL MECH-T ASME NUMER HEAT TR A-APPL ENVIRON FLUID MECH MECH ADV MATER STRUC NUMER HEAT TR B-FUND NONLINEAR DYNAM EUR J MECH A-SOLID J SOUND VIB INT J NUMER METH FL J ADHES SCI TECHNOL J THERM STRESSES FLOW TURBUL COMBUST GRANUL MATTER APPL THERM ENG J COMPOS CONSTR INT J NUMER ANAL MET INT J THERMOPHYS MECH RES COMMUN EUR J MECH B-FLUID FINITE ELEM ANAL DES INT J DAMAGE MECH GEOPHYS ASTRO FLUID KOREA-AUST RHEOL J HEAT TRANSFER ENG INT COMMUN HEAT MASS ENG COMPUTATION THEOR APPL FRACT MEC ACTA MECH Q J MECH APPL MATH INT J FRACTURE J FLUID STRUCT J NON-EQUIL THERMODY MULTIBODY SYST DYN ACTA MECH SINICA（中国，力学学报） ARCH APPL MECH J WIND ENG IND AEROD APPL MATH MODEL MECH TIME-DEPEND MAT J ELASTICITY J VIB ACOUST PROG COMPUT FLUID DY MATH MECH SOLIDS FLUID DYN RES ZAMM-Z ANGEW MATH ME J MECH MICROGRAVITY SCI TEC J POROUS MEDIA CR MECANIQUE REGUL CHAOTIC DYN INT J NUMER METHOD H J STRAIN ANAL ENG NIHON REOROJI GAKK ARCH MECH MECCANICA INT J COMPUT FLUID D J VIB CONTROL HEAT MASS TRANSFER WIND STRUCT MECH BASED DES STRUC ACTA MECH SOLIDA SIN（中国，固体力学学报） SHOCK WAVES MECH COMPOS MATER EXP TECHNIQUES INT J APPL ELECTROM DOKL PHYS P I MECH ENG K-J MUL APPL MATH MECH-ENGL（中国，应用数学和力学） PMM-J APPL MATH MEC+ SHOCK VIB SOUND VIB 博主注：所列3个中国期刊中，《力学学报》近年来按影响因子排名最高，稳定在70-80之间。以上列表欢迎大家补充，欢迎对期刊进行评论。
除了通常所知的李约瑟悖论外，李约瑟还有这样一个假设：如果科学起源于中国的话，那么一开始就不是力学，可能是电磁学。 思路一：量纲。 在科学史上，按现在的标准，称得上是科学的最早的学科是几何学和力学。几何学的量纲是 L ，长度，还有弧度，运动学加上时间 T ，力学再加上质量 m ，阿基米德时代可能是重量。接着电磁学、化学，还要加 I 电流强度和 n ，参加反应的物质的量，等等。生物学的量纲多到数不清。于是，随着研究的对象由简单到复杂，相应学科，知识体系的量纲就越来越多。研究人的人学有多少个量纲？西方的科学从什么地方开始，首先几何学。这不是没有道理的，从最简单的东西开始。譬如丈量土地，不需要其它的量纲，只涉及到长度、角度。科学从最简单地方的开始，这就是古希腊的科学为什么只有力学、几何学、天文学的原因。看看天文学本身发展的过程，天文学从哪里开始？从星体的相对位置开始，也就是几何学天文学，然后到了牛顿时代，才有了力，它什么会运动？可以称为力学天文学。到了 19 世纪，天体的能量从何而来，也就是天体的产能机制，等等。量纲逐步增加。从量纲的角度，科学可能从电磁学开始吗？固然，中国有雷公雷婆，那是神话；中国发明了指南针，那是技术。 思路二：然而，真的如此吗？ 上述思路存在的问题是什么呢？就是根据现有科学的发展，来推这种可能性，这种思路的本身就受到了已有东西的限制。如果科学先从电磁学开始的话，它一定就换一种思路，避开量纲。为什么一定得从量纲开始讨论问题？这值得探讨。文化的量纲呢？文化需要量纲吗？量纲由简到繁的思路，是一条过于简单、线性和机械的思路。如果沿着这样的思路和发展路径，文化是如此复杂多变，可能此刻我们还等候在量纲铺就的阶梯的某处，等候科学的量纲之车快快来到，更可能的是，我们将永远没有文化。文化可能根本没法用量纲来堆砌。由科学到文化不是一条逻辑的渐进的可以推理的路，在这条路上充满了分岔、河流和山峰。 量纲，所标志的是编码知识。编码知识未必都有量纲，但有量纲的一定是编码知识。科学，至少其中的大部分是编码知识，文化能像科学一样编码？能还原为一连串的量纲吗？科学未必是唯一的标准，或者说，只是给出了一半的标准，另一半呢？文化！实际上，科学在西方的发展沉浸于特定的文化之中，正是在这样的文化中才会有由简到繁的路径。量纲之路并不超然出世。
标签: 力学
