喷印技术直接将功能材料沉积到基板上形成图案，有望成为高性能柔性电子的主流制造工艺之一。目前，喷印技术面临材料、工艺和设备等诸多挑战。讨论无机、有机以及纳米复合喷印材料的电学性能，分析了打印性能与粘度、表面张力、蒸发率等关系。压电、热泡等传统喷印可实现微米级分辨率图案化，而电喷涂、电纺丝、电喷印等电流体动力喷印可实现纳米级分辨率图案化，如何通过多场调控提高其喷印过程操控性至为关键。讨论了电流体动力喷印设备实现关键技术，包括液滴操控、喷嘴设计、卷到卷输送等。最后展望了柔性电子喷印制造需研究并解决的关键科学技术问题。 ZP Yin, YA Huang, NB Bu, XM Wang, YL Xiong, Inkjet printing for flexible electronics: Materials, processes and equipments, Chinese Science Bulletin, 2010 - Springer 论文地址： http://www.springerlink.com/content/p6771x85l7574u07/ 论文下载： Inkjet printing for flexible electronics- Materials, processes and equipments.pdf
国际动态 1.LG推出19寸柔性显示屏， http://www.it007.com/html/A/Art_36837.html 2.电子书市场继续膨胀，多家单位大力推广次技术，汉王电子借此产品另行上市，今年准备推出彩屏。 http://tech.sina.com.cn/b/2010-03-29/13431295894.shtml 3.电子纸：E-Ink高度垄断 新技术艰难推进 http://it.sohu.com/20100207/n270109061.shtml 4.德国制成有机薄膜半导体材料 可做弯曲显示器 http://www.cnbeta.com/articles/106447.htm 5.麻省理工学院科学家利用共聚物材料的自组装特性开发出新型掩模技术 http://www.cnbeta.com/articles/106432.htm 会议讲座 1.Gordon Conference 2010 Thin Film Small Scale Mechanical Behavior 会议网址： http://www.grc.org/programs.aspx?year=2010program=thinfilm 召开时间：July 25-30, 2010 2.18th Annual International Conference on COMPOSITES/NANO ENGINEERING (ICCE -18), Anchorage, Alaska,USA, 会议网址： http://myweb.polyu.edu.hk/~mmktlau/ICCE/ICCE_Main.htm 召开时间：July 4-10, 2010 3.7th International Tutorial Workshop on PFM and Nanoscale Electromechanics of Polar Materials, August 25-27, 2010, Beijing, China http://www.ustb.edu.cn/materials/files/pfm/International_Workshop.html 4.IUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures http://www.cstam.org.cn/Upfiles/20102/20102240624.pdf August 8-13, 2010，Peking University, Beijing, China 5.2010 International Conference onElectronic Packaging Technology High Density Packaging(2010电子封装技术和高密度封装国际会议) (ICEPT-HDP2010) http://cn.icept.org/ 召开时间：2010年 8月16日 --19日，召开地点：中国西安 6.18th International Conference on Composites or Nano Engineering ICCE-18 Anchorage, Alaska,USA, July 4-10, 2010 http://www.uno.edu/~engr/composite 7.ASME IMECE2010 Symposium on Integrated Structures and Hybrid Materials Date: November 12-18, 2010 Venue: Vancouver, British Columbia, Canada. http://www.imechanica.org/node/7637 领域介绍 讨论:Journal Club February 2010: Mechanics of Patterned and Structured Interfaces http://www.imechanica.org/node/7479 专著:《毛细力学》，属微纳米技术著作丛书，高世桥等，科学出版社，2010.1；该书介绍了毛细力学的基础知识，并介绍了表界面力学等，对其中涉及的若干方程进行了论述。
一直没有将月报贴出来，拖了这么久，还请见谅，争取以后能够按时分享。 国际动态 1.LG展示19英寸可弯曲电子纸原型 http://www.cnbeta.com/articles/102248.htm 2.上海交大创办英文国际学术期刊《纳米/微米通讯》 http://www.nmletters.org 会议讲座 1. Gordon Conference 2010 Thin Film Small Scale Mechanical Behavior 会议网址： http://www.grc.org/programs.aspx?year=2010program=thinfilm 召开时间：July 25-30, 2010 2. 8th Annual International Conference on COMPOSITES/NANO ENGINEERING (ICCE -18), Anchorage, Alaska,USA, 会议网址： http://myweb.polyu.edu.hk/~mmktlau/ICCE/ICCE_Main.htm 召开时间：July 4-10, 2010 3. 7th International Tutorial Workshop on PFM and Nanoscale Electromechanics of Polar Materials, August 25-27, 2010, Beijing, China http://www.ustb.edu.cn/materials/files/pfm/International_Workshop.html 4. ASME 2010 International Mechanical Engineering Congress Exposition http://www.asmeconferences.org/Congress2010/index.cfm Abstract Submission: Deadline: March 1, 2010 5. IUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures http://www.cstam.org.cn/Upfiles/20102/20102240624.pdf August 8-13, 2010，Peking University, Beijing, China 领域介绍 专家Richard Friend，Optoelectronics Group, Cavendish Laboratory，从事有机功能材料的研发，从事光电子方面的研究。获得第一个聚合物发光二极管方面的专利。 http://www-oe.phy.cam.ac.uk/people/oestaff/rhf10.htm 报告1.Open source code on Multiscale http://www.imechanica.org/node/7380 报告2.新一代OLED有机平板显示器大规模制造技术，2010年1月26日 专著《有机电子学概论》重点阐述了有机电子器件的材料、器件的制作和原理及所涉及的相关机制问题。 http://product.dangdang.com/product.aspx?product_id=20749959
Thermomechanical analysis of thin films on temperature-dependent elastomeric substrates in flexible heterogeneous electronics Thin Solid Films, Volume 518, Issue 6, 1 January 2010, Pages 1698-1702 Yongan Huang, Zhouping Yin, Youlun Xiong Abstract Thermomechanical analysis is presented to study the basic temperature effects on elastomeric substrate of flexible electronics. Strains of a films-on-substrate structure related with three key temperatures are given based on the interfacial continuum model. An improved strain model is given and compared with other two models. The role of the temperature-dependent effects is highlighted and adopted to design a flexible inorganic/organic heterogeneous structure subject to little thermal action. The sensitivity analysis of three key temperatures is investigated, by which proper selection of technological parameter for poly(dimethylsiloxane) fabrication may be determined to eliminate the variation of stress of the interface in circumstances with temperature varying severely. This work contributes to systemic reliability and compatibility, structural design and thermal management of flexible electronics.
Dear Colleague: We would like to let you know of our symposia Failure of Small-Scale Structures at the 2010 TMS Annual Meeting. This symposia will focus on failures in small scale structures (flexible and semiconductor electronic systems, actuators, resonating cantilever, biological systems, fuel cells, MEMS devices, etc) and will discuss combinations of possible failure mechanisms. Possible mechanisms could include, but are not limited to: electromigration, diffusion, crack formation and propagation, oxidation, corrosion, fatigue (thermal, corrosion, cyclic), creep, delamination, wear etc. Anticipated topics include: fracture and deformation of small-scale biological systems, nanowires/nanotubes, thin films and film structures, microlectronics, MEMS, micro pillars, etc. . Invited speakers to include: Markus Buehler (MIT), Bob Keller (NIST), Jianyu Huang (Sandia National Labs), Xiao-Yan Gong (Medical Implant Mechanics), William Nix (Stanford), Daniel Gianola (U. Penn), Julia Greer (Cal Tech), Ahmed-Amine Benzerga(Texax AM), Mike Dugger (Sandia National Labs), Chung-Souk Han (North Dakota State), Gerhard Dehm (MU-Leoben), Michael Uchic (Air Force Research Labs), and Johann Michler (EMPA). More information can be found at: http://www.tms.org/meetings/annual-10/AM10home.aspx
逐步收集，慢慢分享。具体如下： Instrument of SHU-SOLARE RD Joint-Lab: http://www.shu-solare.org/ Printed Nano Electronics Lab http://www.postech.ac.kr/lab/mse/twlee/index.htm the Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems (Nano-CEMMS) http://www.nano-cemms.uiuc.edu/ Laboratory for Thin Films Nanosystems and Nanometrology: http://ltfn.physics.auth.gr/
All about Flexible Macroelectronics: http://www.macroelectronics.org/ FlexTech Alliance: http://www.flextech.org/ The FlexTech Alliance is the only organization headquartered in North America exclusively devoted to fostering the growth, profitability and success of the electronic display and flexible, printed electronics supply chain. Flexible Display Center at ASU: http://flexdisplay.asu.edu/ Our vision is to evolve and leverage the Flexible Display Centers world-class flexible display capabilities, in concert with other ASU synergistic research, to achieve a leadership position in the emerging flexible electronics industry and establish ASU as a high-value government and industry resource. OLED-Info: http://www.oled-info.com/ OLED: Next generation display and TV technology Printed-Electronics World: http://printedelectronics.idtechex.com/ Printed Electronics World articles Research reports Suppliers researcher database Events RFID Gazette: http://www.rfidgazette.org/ Radio Frequency Identification news and commentary. Displaybank: http://www.displaybank.com/eng/report/report.php
1. Sigurd Wagner http://www.princeton.edu/~wagner/index.htm He is working on devices, processes, and materials for large-area electronics, which is also called macroelectronics or giant electronics. 2. Zhigang Suo http://www.seas.harvard.edu/suo/ Allen E. and Marilyn M. Puckett Professor of Mechanics and Materials, School of Engineering and Applied Sciences, Harvard University 3. Yonggang Huang http://www.civil.northwestern.edu/people/huang.html Mechanics of materials and structures; fracture mechanics; composite materials; micromechanics; atomistic-based continuum mechanics; mechanics of stretchable electronics. 4. John A Rogers http://rogers.mse.uiuc.edu/ He seeks to understand and exploit interesting characteristics of 'soft' materials, such as polymers, liquid crystals, and biological tissues as well as hybrid combinations of these materials with unusual classes of inorganics, such as nanoribbons, wires and platelets. 5. Ian Hutchings http://www.ifm.eng.cam.ac.uk/pp/publications/imh.html The Inkjet Research Centre has established an Inkjet Interest Group as part of the EPSRC and industry funded project investigating fundamental aspects of inkjet. 6. Zhenan Bao http://baogroup.stanford.edu/ Energy, organic semiconductors, transistors, solar cells, carbon nanotube, transparent electrodes, sensors, soft materials, organic and polymer synthesis and characterization, nano- and micropatterning, bio-inspired assembly, and device fabrication and characterization. 7. Vivek Subramanian http://www.eecs.berkeley.edu/~viveks/ His research interests include advanced CMOS devices and technology and polysilicon thin film transistor technology for displays and vertical integration applications. His current research focuses on organic electronics for display, low-cost logic, and sensing applications. He has authored or co-authored more than 40 research publications and patents. 8. William D. Nix http://soe.stanford.edu/research/layout.php?sunetid=nix Hiscurrent work deals with the mechanical properties of nanostructures and with strain gradients and size effects on the mechanical properties of crystalline materials. 8. Liwei Lin http://www.me.berkeley.edu/~lwlin/ MEMS (Microelectromechanical Systems); NEMS (Nanoelectromechanical Systems); Nanotechnology; design and manufacturing of microsensors and microactuators; development of micromachining processes by silicon surface/bulk micromachining; micro moulding process; mechanical issues in microelectromechanical systems (MEMS) including heat transfer, solid/fluid mechanics and dynamics. 9. George Whitesides http://gmwgroup.harvard.edu/ updating
Pattern topics: Inkjet printing of polymers: state of the art and future developments , by B.J. de Gans et al. Direct writing technologyAdvances and developments , K.K.B. Hon et al. Recent progress in soft lithography , John A. Rogers et al Progress and Trends in Ink-Jet Printing Technology , Hue P. Le Material topics Material challenge for flexible organic devices , by Jay Lewis Organic and polymer transistors for electronics , by Ananth Dodabalapur Mechanics topics Micromechanics of macroelectronics , Suo Zhigang 柔性电子系统及其力学性能 ，许巍，卢天健 Roll-to-Roll manufacturing ... Applications: Cover story: Jet printing flexible displays , by R.A. Street et al.
标签: 柔性电子
